发明名称 PROFILE THERMOMODULE FOR CIRCULAR COOLING PLATE AND CIRCULAR COOLING PLATE USING THE SAME
摘要 PURPOSE: To provide a profile thermomodule that arranges thermomodules on a circular plate as close as possible, improves cooling capability (cooling power), and at the same time, can reduce temperature distribution, and to provide a circular cooling plate using the profile thermomodule. CONSTITUTION: A plurality of three kinds of profile thermomodules 35, 36, and 37 is arranged in a multi-ring shape to the circular plate 31, while the short side opposite to the long one faces the center. In the profile thermomodules, a Peltier element is provided between a pair of heat transfer plates. In this case, the heat transfer plates are set into a trapezoid, square, or rectangular shape, and have a slanting section slanted so that one side held between a pair of opposite sides becomes narrow in the pair of opposite sides.
申请公布号 KR20020047007(A) 申请公布日期 2002.06.21
申请号 KR20010079244 申请日期 2001.12.14
申请人 SMC CORPORATION 发明人 SAIKA MASAO
分类号 F25B21/02;H01L21/324;H01L23/367;H01L23/38;H01L35/32;(IPC1-7):H01L21/324 主分类号 F25B21/02
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