| 摘要 |
PROBLEM TO BE SOLVED: To enhance stability and efficiency in the measuring work of a semiconductor chip by preventing a stress from being applied to a pad when a probe needle touches the pad. SOLUTION: A probe card 9 comprises a probe needle 9b and a probe needle support 9a. The probe needle 9b comprises a tubular hollow section 9ba and a liquid sump section 9bb having a diameter larger than that of the tubular hollow section 9ba and bonded to the forward end part thereof wherein the liquid sump section 9bb is filled with mercury 10. At the time of probing, the probe needle 9b is brought close to a pad 15 on a wafer 11 (a). Inner pressure of the probe needle support 9a is then raised to push down the mercury 10 so that the forward end thereof touches the pad 15 (b). Upon finishing measurement of a pellet, inner pressure of the probe needle support 9a is lowered to pull up the mercury 10 and to separate it from the pad 15.
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