| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing device capable of surely sucking and holding a wafer. SOLUTION: In this wafer polishing device provided with a protective sheet 34 on a lower part of a carrier 24, a lower face of the carrier 24 is divided into plural regions, air grooves 38, 38... are formed on each region, and plural air holes 68, 68... corresponding to the air grooves 38, 38... are formed on the protective sheet 34. Therefore, the air can be sucked from plural regions, the wafer W can be sucked over a wire regions, and the suction force to the water W can be increased. |
