DIELECTRIC COMPOSITION FOR MANUFACTURING INSULATING STRUCTURES

摘要

The invention relates to a dielectric composition for manufacturing an insulating structure that comprises at least one dielectric resin. The composition consists of granules of a thermo-fixed polymer and a dielectric resin in a thermo-fixed polymer/dielectric resin ratio ranging from 2:1 to 20:1. This makes it possible for the composition to withstand voltages of at least 45kV and to exhibit a resistance of at least 25M OMEGA . The invention also relates to dielectric structures obtained from said composition, wherein dielectric rigidity of said structures can be enhanced by means of a dielectric resin coating.