发明名称 METHOD FOR FORMING ELECTRICAL CONTACT STRUCTURE
摘要 PURPOSE: A method for forming an electrical contact structure is provided to uniformly distribute particles uniform and prevent the particles from sinking. CONSTITUTION: A volatile liquid mixed with conductive particles(50) is sprayed to a contact face of one of two substrates(10,40) that are attached to each other, to coat the conductive particles on the contact face. The contact faces of the two substrates come into contact with each other. Paste(30) is infiltrated into the space between the two substrates to attach the two substrates to each other. The volatile liquid is alcohol or Freon.
申请公布号 KR100342039(B1) 申请公布日期 2002.06.12
申请号 KR19940038991 申请日期 1994.12.29
申请人 SAMSUNG SDI CO., LTD. 发明人 LEE, CHANG HUN
分类号 H01R43/00;H01B1/20;H01L21/60;H01R11/01;H05K3/10;H05K3/32;(IPC1-7):H01R11/01 主分类号 H01R43/00
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