发明名称 |
Thermosetting soldering flux and soldering process |
摘要 |
A soldering flux suitable for soldering of small electronic components comprises 0.1-50 mass percent of an organic acid, 5-40 mass percent of a solvent, and 10-95 mass percent of a thermosetting resin (including a curing agent), which is preferably a bisphenol A epoxy resin and an acid anhydride or amine curing agent. This flux can be used to prepare a solder paste by mixing with solder powder. This soldering flux can secure an electronic component simultaneously by soldering and by the resin, simply by a soldering operation at a soldering temperature of at least 150° C., and cleaning after soldering is no longer necessary.
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申请公布号 |
US6402013(B2) |
申请公布日期 |
2002.06.11 |
申请号 |
US20000726588 |
申请日期 |
2000.12.01 |
申请人 |
SENJU METAL INDUSTRY CO., LTD;TDK CORPORATION |
发明人 |
ABE HISAYUKI;TAGUCHI TOSHIHIKO;KAWAMATA YUJI;IWANO AKIKO |
分类号 |
B23K35/36;H05K3/34;(IPC1-7):B23K31/02 |
主分类号 |
B23K35/36 |
代理机构 |
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