APPARATUS FOR DENSE CHIP PACKAGING USING HEAT PIPES AND THERMOELECTRIC COOLERS

摘要

PURPOSE: An apparatus for dense chip package using heat pipes and thermoelectric coolers is provided to minimize a fluid resistance by using a capillary structure based on fractal and structural geometry supplying a maximum capillary force. CONSTITUTION: An apparatus includes an evaporator region(210), a condenser region(225) and a capillary region(220). The evaporator region(210) further includes one or more hot point elements used to transfer heat from a heat source to a transport fluid(260). The transport fluid(260) changes state to a vapor when heat is applied to the transport fluid(260). The vapor travels to the condenser region(225) via vapor channels(235) and is condensed to a fluid once again by transferring heat from the vapor to a heat sink. Then, the condensed fluid is returned to the evaporator region(210) by way of capillary forces and capillaries formed in a capillary structure(245). The apparatus further includes a flexible region that allows the apparatus to be bent around corners and edges.