发明名称 PROCESSING DEVICE AND PROCESSING METHOD WITH THE USAGE OF WIRE
摘要 PROBLEM TO BE SOLVED: To provide a processing device and a processing method capable of surely removing abrasive liquid adhered to a wire at low cost. SOLUTION: An abrasive liquid removing device 11 is installed between a seesaw mechanism part 3 and a processing part 6. The abrasive liquid removing device 11 is constituted by an abrasive liquid removing sheet 12 to be brought into contact with the wire 1 and a support member 15 for supporting the abrasive liquid removing sheet 12. A lower end of the abrasive liquid removing sheet 12 is brought into contact with the reciprocating wire 1 by its weight.
申请公布号 JP2002160151(A) 申请公布日期 2002.06.04
申请号 JP20000356063 申请日期 2000.11.22
申请人 NITTO DENKO CORP 发明人 AZUMA KAZUMI;KOSAKA TOMOJI
分类号 B24B57/02;B24B27/06;(IPC1-7):B24B27/06 主分类号 B24B57/02
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