发明名称 |
PROCESSING DEVICE AND PROCESSING METHOD WITH THE USAGE OF WIRE |
摘要 |
PROBLEM TO BE SOLVED: To provide a processing device and a processing method capable of surely removing abrasive liquid adhered to a wire at low cost. SOLUTION: An abrasive liquid removing device 11 is installed between a seesaw mechanism part 3 and a processing part 6. The abrasive liquid removing device 11 is constituted by an abrasive liquid removing sheet 12 to be brought into contact with the wire 1 and a support member 15 for supporting the abrasive liquid removing sheet 12. A lower end of the abrasive liquid removing sheet 12 is brought into contact with the reciprocating wire 1 by its weight. |
申请公布号 |
JP2002160151(A) |
申请公布日期 |
2002.06.04 |
申请号 |
JP20000356063 |
申请日期 |
2000.11.22 |
申请人 |
NITTO DENKO CORP |
发明人 |
AZUMA KAZUMI;KOSAKA TOMOJI |
分类号 |
B24B57/02;B24B27/06;(IPC1-7):B24B27/06 |
主分类号 |
B24B57/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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