发明名称 WAFER ALIGNER EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide wafer aligner equipment which enables alignment of both a circular wafer and a square wafer. SOLUTION: This wafer aligner equipment is provided with a wafer rotating apparatus 100 which holds a wafer WF on a turn table and rotates the wafer, a wafer elevating apparatus 102, an edge position detector 12 for detecting an edge position of a wafer, a rotating angle detector 103 for detecting an angle of rotation of the turn table, a turn table moving apparatus 101, a storage device 22 for storing an edge position detecting signal and an angle detecting signal which are outputted from the detectors 12 and 103, an eccentric amount calculating means 104 for calculating eccentric amount of a wafer, and an aligning means 105 for correcting the eccentric amount of a wafer. The eccentric amount calculating means 104 is constituted of an eccentric amount calculating means for the circular wafer, and an eccentric amount calculating means for the square wafer.
申请公布号 JP2002151575(A) 申请公布日期 2002.05.24
申请号 JP20000345314 申请日期 2000.11.13
申请人 DAIHEN CORP 发明人 MORITA KATSUYUKI
分类号 G01B11/00;H01L21/68;(IPC1-7):H01L21/68 主分类号 G01B11/00
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