| 摘要 |
PROBLEM TO BE SOLVED: To provide a development device capable of controlling the flow of air, so as to prevent impurities from attaching to a wafer and keep the temperature distribution of the surface of the wafer. SOLUTION: A gap 73 is formed between a cup side portion 66 and a cup bottom portion 67 of a cup 65 surrounding a wafer W. The cup side portion 66 is provided with a mechanism 69 for moving vertically, on the cup side portion 66 to adjust the gap 73. The cup 65 is provided with an exhaust pipe 71 for exhausting air supplied from above a casing 18a into it. By adjusting the gap 73, flow of the air flowing through the gap 73 can be adjusted, which results in adjusting the flow of the air flowing into the cup 65, directly from above the cup 65 and the flow of the air flowing out of the cup 65. In this manner, when impurities are floating, the amount of air flowing directly into the cup 65 is increased, and when the surface temperature of the wafer W needs to be maintained, the amount of air flowing out of the cup 65 is increased. |
