发明名称 BONDER
摘要 PROBLEM TO BE SOLVED: To provide a bonder in which displacement of an oscillating lever can be detected stably by detecting the displacement of a vertical driver. SOLUTION: The bonder comprises an oscillating lever 12 for moving a bump electrode forming wire 1 up and down, a vertical driver 14 fixed to the oscillating lever 12 and oscillating it to move up and down, and a sensor 20 for detecting displacement of the oscillating lever 12. The displacement sensor 20 has a scale 20a fixed to the end part 14c of a coil 14b in the vertical driver 14 so that displacement of the oscillating lever 12 is detected by detecting displacement of the vertical driver 14. Displacement of the oscillating lever 12 can be detected stably because it is not detected from a rotary shaft 15 but by detecting displacement of the vertical driver 14 integrated with the oscillating lever 12.
申请公布号 JP2002151544(A) 申请公布日期 2002.05.24
申请号 JP20000346743 申请日期 2000.11.14
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TOKUNAGA TETSUYA;YONEZAWA TAKAHIRO;KIYOMURA HIROYUKI;SASAOKA TATSUO
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址