| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of efficiently manufacturing a semiconductor device which can be filled high with an inorganic filler and is excellent in resistance to soldering heat, under excellent moldability with few defects, and a semiconductor device obtained by that manufacturing method. SOLUTION: This is a manufacturing method for a semiconductor device, which performs pressurization and filling while giving vibration to a mold 3, when the user injects a heated epoxy resin composition 4 into the above mold 2 installed in a transfer mold machine and pressurizes it by means of a plunger 1 and seals the semiconductor device. The epoxy resin composition contains epoxy resin, a hardener, an inorganic filler as essential components, and contains an inorganic filler at a high rate of 84 wt.% or over.
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