发明名称 |
LAPPING TAPE FOR MOLDING FIBER-REINFORCED PLASTIC AND FIBER-REINFORCED PLASTIC AS WELL AS ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a lapping tape for molding an FRP easy to be released capable of giving a sufficient molding pressure at a curing time as the lapping tape by eliminating or reducing polishing after molding. SOLUTION: The lapping tape for molding the fiber-reinforced plastic comprises a rough surface having a surface roughness (Ra) specified by JIS B 0601-1982 of a range of 10 to 100μm on at least one side surface.
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申请公布号 |
JP2002144439(A) |
申请公布日期 |
2002.05.21 |
申请号 |
JP20000340316 |
申请日期 |
2000.11.08 |
申请人 |
TORAY IND INC |
发明人 |
HIRANO SEIJI |
分类号 |
B32B5/02;B29C70/06;B32B27/36;(IPC1-7):B29C70/06 |
主分类号 |
B32B5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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