发明名称 LAPPING TAPE FOR MOLDING FIBER-REINFORCED PLASTIC AND FIBER-REINFORCED PLASTIC AS WELL AS ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a lapping tape for molding an FRP easy to be released capable of giving a sufficient molding pressure at a curing time as the lapping tape by eliminating or reducing polishing after molding. SOLUTION: The lapping tape for molding the fiber-reinforced plastic comprises a rough surface having a surface roughness (Ra) specified by JIS B 0601-1982 of a range of 10 to 100μm on at least one side surface.
申请公布号 JP2002144439(A) 申请公布日期 2002.05.21
申请号 JP20000340316 申请日期 2000.11.08
申请人 TORAY IND INC 发明人 HIRANO SEIJI
分类号 B32B5/02;B29C70/06;B32B27/36;(IPC1-7):B29C70/06 主分类号 B32B5/02
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