发明名称 METHOD FOR ETCHING METAL LINE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE: An etching method of metal lines is provided to prevent an undercut by preventing side etching of metal film using a dummy pattern. CONSTITUTION: First, a mask having metal patterns and dummy patterns is prepared. In the mask, the dummy pattern is spaced apart from the metal pattern. That is, the spaced distance is about 2 time more than compared to the width of the metal pattern. After depositing a metal film on an insulating layer(11), metal lines(12) are formed by selectively etching the metal film. At this time, a dummy pattern(13) is simultaneously formed on the insulating layer by using the mask.
申请公布号 KR20020036294(A) 申请公布日期 2002.05.16
申请号 KR20000066428 申请日期 2000.11.09
申请人 HYNIX SEMICONDUCTOR INC. 发明人 SHIN, GANG SEOP
分类号 H01L21/3213;(IPC1-7):H01L21/321 主分类号 H01L21/3213
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