Kunststoffkörper eines Leitungshalbleiters zur Oberflächenmontage mit optimierten charakteristischen Abmessungen zur Benutzung von Standard-Transport- und Testhaltern

摘要

A QFP plastic surface-mounting semiconductor power device, comprising a plastic package inside which there is provided a chip which is connected by means of conductors to terminals that protrude from the plastic package, and a heat sink plate (2) that is arranged on the bottom of the plastic package and has thinner ends (2'); its particularity is that the length (LH) of the heat sink plate is at least equal to the minimum length (Lp) of the plastic package, channels being formed in the plastic package in a position that is adjacent to the thinner ends of the heat sink plate.