发明名称 CALIBRATION JIG AND CALIBRATION DEVICE FOR WAFER-POLISHING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a calibration jig and a calibration system for a wafer- polishing apparatus which can carry out the calibration easily and accurately. SOLUTION: A calibration jig 50 detects a pushing pressure of a carrier 24 and a pushing pressure of a retainer ring 28 individually with a carrier load-cell 58 and a retainer load-cell 60 respectively. The calibration is carried out automatically by a controller 42, according to the pressing pressures of the carrier 24 and retainer 28 detected by the calibration jig 50.
申请公布号 JP2002134446(A) 申请公布日期 2002.05.10
申请号 JP20000322523 申请日期 2000.10.23
申请人 TOKYO SEIMITSU CO LTD 发明人 KABURAGI MITSUHIRO;INABA TAKAO
分类号 B24B49/10;B24B37/005;B24B37/30;B24B37/32;B24B49/16;H01L21/304 主分类号 B24B49/10
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