发明名称 |
CALIBRATION JIG AND CALIBRATION DEVICE FOR WAFER-POLISHING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a calibration jig and a calibration system for a wafer- polishing apparatus which can carry out the calibration easily and accurately. SOLUTION: A calibration jig 50 detects a pushing pressure of a carrier 24 and a pushing pressure of a retainer ring 28 individually with a carrier load-cell 58 and a retainer load-cell 60 respectively. The calibration is carried out automatically by a controller 42, according to the pressing pressures of the carrier 24 and retainer 28 detected by the calibration jig 50. |
申请公布号 |
JP2002134446(A) |
申请公布日期 |
2002.05.10 |
申请号 |
JP20000322523 |
申请日期 |
2000.10.23 |
申请人 |
TOKYO SEIMITSU CO LTD |
发明人 |
KABURAGI MITSUHIRO;INABA TAKAO |
分类号 |
B24B49/10;B24B37/005;B24B37/30;B24B37/32;B24B49/16;H01L21/304 |
主分类号 |
B24B49/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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