| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that many man-hours are taken because the conventional manufacturing method of a hybrid integrated circuit device is arranged in a process for attaching from small-sized parts to large-sized parts in good order. SOLUTION: The manufacturing method is provided with a process for adhering an electrically conductive brazing material 3 to the desired electrically conductive path 2 of a hybrid integrated circuit board 1, a process for collectively mounting circuit elements 4, 7, 11 fixed by at least the brazing material 3 on the electrically conductive path 2, and a process for collectively melting the electrically conductive brazing material 3 in a melting furnace and fixing the circuit elements on the electrically conductive path 2. Particularly, After chip parts 4 fixed by solder paste, a bump 4 and a power transistor 11 are printed by a solder cream 3, they are collectively mounted, and a simple line making a plurality of the conventional process one line is realized by collectively melting it in a solder melting furnace.
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