| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the sealing metal layers of adjacent wiring boards are adhered to each other and cannot be accurately divided into the individual wiring boards. SOLUTION: The manufacturing method of the wiring board comprises a process wherein a ceramic green sheet 11 is divided into a plurality of areas 13 making rectangles by vertical and horizontal virtual lines, next, through holes 16 of the diameter of 0.1 to 0.25 mm are formed in the center part of each area 13 on the horizontal virtual line of the ceramic green sheet 11, next, a first division groove 17a is formed on the horizontal virtual line, a second division groove 17b is formed on the vertical virtual line, thereafter the ceramic green sheet 11 is baked and cut and divided along each division groove 17a, 17b. |
