发明名称 |
EQUIPMENT FOR MOUNTING CONDUCTIVE BALL |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive ball mounting equipment good in workability. SOLUTION: The defects or position deviations of conductive balls 3 on a wafer 2 mounted in a batch mounting equipment part 10 are examined with an inspection equipment part 20. The conductive balls 3 are installed on the parts with missing balls with a missing correction equipment part 40 when conductive balls 3 are missing. The position of conductive balls 3 may be corrected with the missing correction equipment part 40 when positions of conductive balls 3 are deviating.
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申请公布号 |
JP2002134539(A) |
申请公布日期 |
2002.05.10 |
申请号 |
JP20000319123 |
申请日期 |
2000.10.19 |
申请人 |
HITACHI VIA MECHANICS LTD |
发明人 |
SHIGA MASAYUKI;TSUCHIYA AKIRA |
分类号 |
H01L21/66;H01L21/60;H05K3/34;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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