发明名称 EQUIPMENT FOR MOUNTING CONDUCTIVE BALL
摘要 PROBLEM TO BE SOLVED: To provide a conductive ball mounting equipment good in workability. SOLUTION: The defects or position deviations of conductive balls 3 on a wafer 2 mounted in a batch mounting equipment part 10 are examined with an inspection equipment part 20. The conductive balls 3 are installed on the parts with missing balls with a missing correction equipment part 40 when conductive balls 3 are missing. The position of conductive balls 3 may be corrected with the missing correction equipment part 40 when positions of conductive balls 3 are deviating.
申请公布号 JP2002134539(A) 申请公布日期 2002.05.10
申请号 JP20000319123 申请日期 2000.10.19
申请人 HITACHI VIA MECHANICS LTD 发明人 SHIGA MASAYUKI;TSUCHIYA AKIRA
分类号 H01L21/66;H01L21/60;H05K3/34;(IPC1-7):H01L21/60 主分类号 H01L21/66
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