发明名称 RESIN COMPOSITE MATERIAL AND ITS FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method for forming on the surface of a resin substrate a resin composite material having a metal element-containing component or film excellent in adhesion properties and not having a catalyst layer formed in the case of electroless plating by a relatively simple treatment step comprising a plasma treatment and a wet process without polluting working environments and the global environment. SOLUTION: The resin composite material, which has a metal element- containing component on the surface of a resin substrate and is obtained by a wet method, has no catalyst layer and is more excellent in adhesion properties between the resin substrate and the metal element-containing component and in uniformity of the film thickness of the metal element-containing film than conventional resin composite materials obtained by a wet method. As the method for forming the resin composite material dispenses with an etching treatment and an electroless plating treatment indispensable for conventional wet methods, it allows simple manufacture without causing deterioration in working environments and pollution of the global environment and the like which might be caused by such treatments.
申请公布号 JP2002128926(A) 申请公布日期 2002.05.09
申请号 JP20000370377 申请日期 2000.12.05
申请人 LEARONAL JAPAN INC 发明人 KIYOTA MASARU;TSUCHIDA HIDEKI;IMANARI MASAAKI;YOMOGIDA KOICHI;NAWAFUNE HIDEMI
分类号 C08J7/06;B32B15/08;C08J7/00;(IPC1-7):C08J7/06 主分类号 C08J7/06
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