| 摘要 |
PROBLEM TO BE SOLVED: To provide a moisture-curing adhesive composition suited for bonding a heating panel used for floor heating to a flooring material. SOLUTION: This composition comprises component (a) a moisture-curing polymer having a double bond in the molecular chain, component (b) at least either of a hindered phenolic antioxidant and a hindered amine antioxidant, and component (c) at least either of a thioether antioxidant and a phosphite antioxidant. As component (a), a moisture-curing urethane polymer having a double bond derived from butadiene is particularly desirable. It is desirable that the ratio of component (b) to component (c) is 1-20 pts. mass (c), per pt. mass (b). It is desirable that the composition has a total content of components (b) and (c) of 0.01-5 mass %.
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