发明名称 |
RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR DEVICE OBTAINED WITH THE SAME, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE |
摘要 |
<p>The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability. The resin composition for semiconductor encapsulation comprises: (A) an epoxy resin; (B) a phenolic resin; (C) a latent curing accelerator; and (D) an inorganic filler, and has a viscosity of 7,000 poise or more at 25 DEG C and 5,000 poise or less at 80 DEG C.</p> |
申请公布号 |
EP1203792(A1) |
申请公布日期 |
2002.05.08 |
申请号 |
EP20000904050 |
申请日期 |
2000.02.21 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
HARADA, TADAAKI;TAKI, HIDEAKI;HOSOKAWA, TOSHITSUGU |
分类号 |
C08G59/62;C08L61/04;C08L63/00;H01L23/29;(IPC1-7):C08L63/00;C08G59/40;C08K3/36 |
主分类号 |
C08G59/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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