| 摘要 |
PURPOSE:To provide a semiconductor package which is composed of a first printed wiring board mounted with semiconductors and a second printed wiring board where outer leads are provided corresponding to the gate terminals of the semiconductors, wherein the first and the second wiring board can be aligned with each other and connected high in reliability. CONSTITUTION:A first printed wiring board 2 and a second printed wiring board 3 are connected together to form a semiconductor package 1, wherein solder bumps 10 provided to the underside of the first printed wiring board 2 are fitted into bump holes 11 provided to the second printed wiring board 3 so as to align the printed wiring boards 2 and 3 with each other. After the printed wiring boards 2 and 3 are positioned to each other, a thermal treatment is carried out at a temperature higher than a fusing point of the bumps 10 and 14, and the bumps 10 and 14 are bonded together by fusion inside the bumps holes 11. |
