| 摘要 |
PURPOSE: Catalyst compositions suitable for depositing electroless metal seed layers and for enhancing discontinuous seed layers are provided, and methods of depositing electroless seed layers and enhancing discontinuous seed layers are provided. CONSTITUTION: The composition suitable for depositing an electroless plating catalyst on a substrate having 1 micrometer or less apertures comprises one or more metal salts, one or more copper complexing agents, one or more organic binders, one or more reducing agents and base, wherein the one or more metal salts are selected from copper or palladium salts, the one or more complexing agents are selected from organic acids, the one or more organic binders are selected from cellulose, hydroxycellulose, hydroxyalkylcellulose such as hydroxymethylcellulose, hydroxyethylcellulose and hydroxypropylcellulose, polysaccharide polymers, cellulose polymers, derivatized cellulose polymers, polymers and copolymers of ethylene oxide and propylene oxide, polyurethane polymers having alternating hydrophobic and hydrophilic moieties, poly(maleic anhydride/methyl vinyl ether), polymethacrylic acid, poly(vinyl alcohol) or naphthalene formaldehyde condensates, and the base is selected from lithium hydroxide, sodium hydroxide, potassium hydroxide, ammonium hydroxide or tetra(C.sub.1-C.sub.4)alkylammonium hydroxide. The method for depositing an electroless plating catalyst on a substrate having 1 micrometer or less apertures comprises the step of contacting the substrate with a composition comprising one or more metal salts, one or more copper complexing agents, one or more organic binders, one or more reducing agents and base. The method for enhancing a discontinuous seed layer comprises the steps of contacting a substrate comprising a discontinuous metal seed layer with a composition comprising one or more metal salts, one or more copper complexing agents, one or more organic binders, one or more reducing agents and base; activating the catalyst; and contacting the catalyst with an electroless plating solution.
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