发明名称
摘要 <p>PROBLEM TO BE SOLVED: To make uniform the thickness of a bonding agent varnish coated film by applying pressure so as to make uniform the coated film thickness while the coated surface is being heated after the solvent is dried up. SOLUTION: A film thickness uniformizing device 16 is composed of a lead frame 1 to be mounted on the upper surface, a stage 18 having a built-in heater 17, a heat block 20 and an air cylinder 21 with which the heat block 20 is vertically driven. The lead frame 1, on which a film is formed, is set on the stage 18, and the heat block 20 is brought down until its lower surface comes in contact with the film 12. The lead frame 1 is pinched by the stage 18 and the heat block 20, and it is heated from both surfaces at about 230 deg.C and pressed by the prescribed pressing force. By heating and pressing the film 12 as above-mentioned, the difference of unevenness between the surface of the film 12 and the lead surface in the vicinity of the film 12 is decreased, and the irregularity of distribution of film thickness can be reduced.</p>
申请公布号 JP3279480(B2) 申请公布日期 2002.04.30
申请号 JP19960151206 申请日期 1996.06.12
申请人 发明人
分类号 H01L21/60;H01L21/52;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L21/60
代理机构 代理人
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