发明名称 |
ELECTRICAL INSULATING METHOD AND ELECTRICAL INSULATING STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide compatibility between high thermal conductivity and full electrical insulation. SOLUTION: A high-temperature body 1 and a low-temperature body 2 are integrated via a solid insulator 3 which is arranged as a pattern, and a liquid insulator 4 is filled in the gaps formed between the bodies 1 and 2.
|
申请公布号 |
JP2002124606(A) |
申请公布日期 |
2002.04.26 |
申请号 |
JP20000317985 |
申请日期 |
2000.10.18 |
申请人 |
DAIKIN IND LTD |
发明人 |
HARADA KOICHI;TERAKI JIYUNICHI;TANAKA MITSUHIRO |
分类号 |
H01L23/36;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/36 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|