发明名称 ELECTRICAL INSULATING METHOD AND ELECTRICAL INSULATING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide compatibility between high thermal conductivity and full electrical insulation. SOLUTION: A high-temperature body 1 and a low-temperature body 2 are integrated via a solid insulator 3 which is arranged as a pattern, and a liquid insulator 4 is filled in the gaps formed between the bodies 1 and 2.
申请公布号 JP2002124606(A) 申请公布日期 2002.04.26
申请号 JP20000317985 申请日期 2000.10.18
申请人 DAIKIN IND LTD 发明人 HARADA KOICHI;TERAKI JIYUNICHI;TANAKA MITSUHIRO
分类号 H01L23/36;(IPC1-7):H01L23/36 主分类号 H01L23/36
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