发明名称 |
Epoxy resin composition, prepreg and metal-clad laminate |
摘要 |
An epoxy resin composition of the invention comprises: an epoxy resin; a hardening agent; and a phenol-modified polyphenylene oxide having a number average molecular weight of 1000 to 4000, which is prepared by carried out a redistribution reaction between a polyphenylene oxide and a phenol compound in the presence of a reaction initiator which can be decomposed to generate an alcohol, a prepreg and a metal-clad laminate of the invention contain the epoxy resin composition.
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申请公布号 |
US2002049264(A1) |
申请公布日期 |
2002.04.25 |
申请号 |
US20010911545 |
申请日期 |
2001.07.25 |
申请人 |
MATSUSHITA ELECTRIC WORKS, LTD. |
发明人 |
MAEKAWA TETSUYA;HAYASHI TAKAO;YOSHIMURA TAKESHI;SAITO EIICHIRO;KOMORI KIYOTAKA |
分类号 |
C08G65/48;C08L63/00;C08L71/12;H05K1/03;(IPC1-7):C08L63/00 |
主分类号 |
C08G65/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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