发明名称 Epoxy resin composition, prepreg and metal-clad laminate
摘要 An epoxy resin composition of the invention comprises: an epoxy resin; a hardening agent; and a phenol-modified polyphenylene oxide having a number average molecular weight of 1000 to 4000, which is prepared by carried out a redistribution reaction between a polyphenylene oxide and a phenol compound in the presence of a reaction initiator which can be decomposed to generate an alcohol, a prepreg and a metal-clad laminate of the invention contain the epoxy resin composition.
申请公布号 US2002049264(A1) 申请公布日期 2002.04.25
申请号 US20010911545 申请日期 2001.07.25
申请人 MATSUSHITA ELECTRIC WORKS, LTD. 发明人 MAEKAWA TETSUYA;HAYASHI TAKAO;YOSHIMURA TAKESHI;SAITO EIICHIRO;KOMORI KIYOTAKA
分类号 C08G65/48;C08L63/00;C08L71/12;H05K1/03;(IPC1-7):C08L63/00 主分类号 C08G65/48
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