发明名称 RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in moldability and is capable of forming a molded article excellent in flexibility and heat resistance. SOLUTION: The resin composition comprises [i] a substantially random interpolymer consisting of 1-99 mole % of (1) a polymer unit derived from at least one kind of (a) an aromatic-vinyl or -vinylidene monomer, or at least one kind of (b) a hindered-aliphatic or -alicyclic vinyl or vinylidene monomer or (c) a combination of at least one kind of an aromatic-vinyl or -vinylidene monomer with at least one kind of a hindered-aliphatic or -alicyclic vinyl or vinylidene monomer and of 99-1 mole % of (2) a polymer unit derived from ethylene, or at least one kind of a 3-20Cα-olefin or a combination thereof, and [ii] a syndiotactic polypropylene, with a weight ratio of [i] to [ii] being from 1/99 to 99/1.
申请公布号 JP2002121335(A) 申请公布日期 2002.04.23
申请号 JP20000313901 申请日期 2000.10.13
申请人 MITSUI CHEMICALS INC 发明人 MORIYA SATORU;KIMURA TOMOHIKO
分类号 C08L23/02;C08L23/12;C08L25/00;C08L47/00;C08L51/06;(IPC1-7):C08L23/02 主分类号 C08L23/02
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