| 摘要 |
PROBLEM TO BE SOLVED: To simply repair a broken dicing sheet having a scribed wafer mounted thereon. SOLUTION: A diving sheet 2 having a broken part 4 is cut to ensure a specified region including a wafer 1 without peeling off the wafer 1, a new dicing sheet 22 having a cut region (with the center at a portion corresponding to the wafer 1) smaller in area than the prescribed area region of the but is larger than the area of the wafer 1 overlays the cut dicing sheet 21, and overlaid portions of the old dicing sheet and the new dicing sheet are heated to bond both. |
