Method and apparatus for mounting and packaging electronic components

摘要

A component package having a substrate. The substrate has a component or chip section and a separate assembly section. An array of component pads are disposed on the component section and are adapted to be electrically connected to a component. An array of assembly contact pads are disposed on the assembly section and are adapted to be connected to a next level assembly, such as a printed circuit board. The component contact pads are electrically connected to the assembly contact pads by electrical conductors affixed to the substrate. At least a portion of the substrate between the component section and the assembly section is flexible. The assembly section of the substrate can be secured to a rigid carrier and a casing (or overmolded top) can be mounted to the rigid carrier so as to protect a component enclosed in the package.