发明名称 INTERCONNECTION STRUCTURE, FABRICATING METHOD THEREOF, THIN-FILM-TRANSISTOR SUBSTRATE USING THE SAME AND FABRICATING METHOD THEREOF
摘要 PURPOSE: A method for fabricating a thin-film-transistor(TFT) substrate is provided to prevent an injection signal or image signal from being delayed, by forming a gate interconnection or data interconnection while using an Ag-based metal material layer having lower resistance than that of an Al-based metal material layer. CONSTITUTION: The gate interconnection(22,24,26) of a dual layer structure including the Ag-based metal material layer is formed on a substrate(10). A gate insulation layer(30) covering the gate interconnection is formed. A semiconductor layer is formed on the gate insulation layer. A data line crosses the gate line. A source electrode is in contact with one portion of the semiconductor layer. A drain electrode is in contact with the other portion of the semiconductor layer, corresponding to the source electrode. The drain interconnection includes the data line, the source electrode and the drain electrode. A passivation layer(70) covering the data interconnection(64,65,66) and the semiconductor layer is formed. A contact hole(72,74,76) exposing the drain electrode is formed in the passivation layer. A pixel electrode connected to the drain electrode is formed.
申请公布号 KR20020028005(A) 申请公布日期 2002.04.15
申请号 KR20000058865 申请日期 2000.10.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 NOH, NAM SEOK
分类号 H01L29/786;(IPC1-7):H01L29/786 主分类号 H01L29/786
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