| 发明名称 |
EPOXY RESIN DISPERSION AND ITS COPPER CLAD LAMINATED PLATE AND COPPER CLAD METALLIC SUBSTRATE |
| 摘要 |
PROBLEM TO BE SOLVED: To improve an adhesive property to a metal and rigidity of an epoxy resin. SOLUTION: The epoxy resin dispersion is obtained by dispersing olefin resin particles in the epoxy resin containing a curing agent. |
| 申请公布号 |
JP2002105283(A) |
申请公布日期 |
2002.04.10 |
| 申请号 |
JP20000295972 |
申请日期 |
2000.09.28 |
| 申请人 |
NHK SPRING CO LTD |
发明人 |
YAMADA EISUKE;INAGAKI SHINJI;KUSAKAWA KOICHI |
| 分类号 |
B32B15/092;B32B15/08;C08G59/18;C08L23/00;C08L63/00;(IPC1-7):C08L63/00 |
主分类号 |
B32B15/092 |
| 代理机构 |
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代理人 |
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