| 摘要 |
Apparatus and methods of electrically connecting integrated circuits (40-50) and transducers (28-38) are described. In particular, a transducer (60) includes a base (62) mountable on a substrate (64) (e.g., a printed circuit board), and an input/output (I/O) lead (66) configured to contact an I/O lead (68) of an integrated circuit (70) mounted on the substrate (64). The transducer (60) may be mounted on the substrate (64) to contact the transducer I/O lead (66) to the integrated circuit I/O lead (68). The transducer I/O lead (66) is configured to electrically connect to the integrated circuit I/O lead (68) independently of any electrically conductive path of the substrate (64). The direct electrical connection between the transducer (60) and the integrated circuit (70) provides a high-speed communication channel that avoids the parasitic and high-inductance limitations generally associated with conventional metallic printed circuit board traces. At the same time, the transducer (60) is compatible with existing printed circuit board technologies and integrate circuit technologies and, therefore, may be readily integrated into existing computer systems. |
