| 摘要 |
PROBLEM TO BE SOLVED: To bond silicon oxide-base materials at low temperature without requiring adhesive. SOLUTION: Two silicon oxide-base materials 101 and 102 are placed opposite. Hydrofluoric acid gas 103 is filled between them. Each surface of them is adsorbed with the gas 103, and the atomic bond is cut and chemically activated. They are contacted. The two activated surfaces are bonded and joined.
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