摘要 |
<p>PROBLEM TO BE SOLVED: To miniaturize an electronic product with built-in electronic components such as a semiconductor element, a resistor and a capacitor, to provide it as the electronic product for various uses, to simplify a manufacturing process and to perform efficient production. SOLUTION: In this manufacturing method of the electronic product, rapid prototyping resin is formed by laminating a rapid prototyping resin layer by a rapid prototyping process, insertion components 12 such as the semiconductor element. The resistor and the capacitor are integrally incorporated in the rapid prototyping resin, wiring is formed in the rapid prototyping resin layer, and the insertion components are electrically connected by the wiring. After forming the rapid prototyping resin layer 10 by the rapid prototyping process, the insertion components 12 are loaded on the resin layer. Then, the rapid prototyping resin layer is laminated and formed on the resin layer, and the insertion components 12 are incorporated in the rapid prototyping resin.</p> |