SOLDERING METHOD AND MOUNTING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a soldering method by which an electrical shortcircuit failure due to adhesion of solder tailings to a part or lands can be reduced. SOLUTION: As shown in Figure (a), a pattern 14 for absorbing solder tailings in formed between a hole 11 of a printed board P and a mounting land 13 of a part 12 on the upstream side in the flow direction of the board (indicated by arrow mark A). In addition, as shown in Figure (b), solder tailings 15 produced through the hole 11 when passing a solder jetting device are allowed to be adhered to the pattern 14 for absorbing solder tailings so that they may not reach the mounting land 13, and then the part 12 is soldered.