发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a gate electrode which can ensure full insulation margin by using a reflection prevention film, where an optical constant is adjusted to optimum value, and to provide a self-aligning contact formation method. SOLUTION: A antireflection film 27a, consisting of an oxynitride film, is formed on a conductive layer for gate electrode formation using plasma CVD method. Then, it is exposed to oxygen plasma with N-H bond on the surface of the oxide nitride film being terminated by oxygen. The antireflection film is left as it is in an etching process for forming a gate electrode. An etching process for forming a self-aligning contact is executed by using etching selectivity between the remaining antireflection film and a layer insulation film 31.
申请公布号 JP2002093741(A) 申请公布日期 2002.03.29
申请号 JP20000284731 申请日期 2000.09.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MITSUSHIMA TAKESHI
分类号 H01L21/28;H01L21/3205;H01L21/768;H01L23/52;H01L23/522;H01L29/423;H01L29/43;H01L29/49;H01L29/78;(IPC1-7):H01L21/28;H01L21/320 主分类号 H01L21/28
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