发明名称 |
Technique for manufacturing electronic parts |
摘要 |
A technique for manufacturing electronic parts uses barrel plating to plate films on external electrodes of the electronic parts with small thickness variation of the plated films. The technique comprises disposing a plurality of non-spherical conductive elements in a plating barrel, disposing a plurality of electronic parts in the plating barrel, and rotating the plating barrel to form the plated films on the external electrodes of the electronic parts.
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申请公布号 |
US6361676(B1) |
申请公布日期 |
2002.03.26 |
申请号 |
US19990434163 |
申请日期 |
1999.11.04 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
HORIE SHIGEYUKI;HOSOKAWA TAKAO |
分类号 |
H01G4/12;C25D17/16;C25D17/20;(IPC1-7):C25D17/16 |
主分类号 |
H01G4/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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