发明名称 Technique for manufacturing electronic parts
摘要 A technique for manufacturing electronic parts uses barrel plating to plate films on external electrodes of the electronic parts with small thickness variation of the plated films. The technique comprises disposing a plurality of non-spherical conductive elements in a plating barrel, disposing a plurality of electronic parts in the plating barrel, and rotating the plating barrel to form the plated films on the external electrodes of the electronic parts.
申请公布号 US6361676(B1) 申请公布日期 2002.03.26
申请号 US19990434163 申请日期 1999.11.04
申请人 MURATA MANUFACTURING CO., LTD. 发明人 HORIE SHIGEYUKI;HOSOKAWA TAKAO
分类号 H01G4/12;C25D17/16;C25D17/20;(IPC1-7):C25D17/16 主分类号 H01G4/12
代理机构 代理人
主权项
地址