| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for reliably blocking a flowing silicon material for isolating a support matrix from a semiconductor from creeping into a bonding region of bond leads. SOLUTION: The support matrix for an integrated semiconductor comprises a frame, a conductor path material, at least one bond lead (1) for connecting the conductor path material to the semiconductor, and a silicon material disposed on the support matrix for isolating the support matrix from the semiconductor. The bond lead has at least one groove (7, 8) between a bonding region (3) and the conductor path structure as a barrier to block the silicon material from flowing to the bonding region (3). |
