发明名称 |
HIGH-FREQUENCY POWER AMPLIFIER |
摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency power amplifier having higher performance by preventing characteristic deterioration or thermal runaways, due to heating of a high-frequency power amplifying element. SOLUTION: This high-frequency power amplifier, constituted of at least two semiconductor chips 3 and 7, is provided with a high frequency amplifying element 2 formed on one semiconductor chip 3 for amplifying an inputted high frequency power; and a bias circuit 4 whose at least one part is formed on the same semiconductor chip as that of the high-frequency power amplifying element for setting the operating point of the high-frequency power amplifying element, and is equipped with a reference voltage generating part 5 having the same temperature characteristics as those of the high-frequency power amplifying element.
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申请公布号 |
JP2002084142(A) |
申请公布日期 |
2002.03.22 |
申请号 |
JP20000272192 |
申请日期 |
2000.09.07 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MIYATSUJI KAZUO;KANAZAWA KUNIHIKO |
分类号 |
H03F1/30;H03F3/213;H03F3/24;(IPC1-7):H03F1/30 |
主分类号 |
H03F1/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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