发明名称 HIGH-FREQUENCY POWER AMPLIFIER
摘要 PROBLEM TO BE SOLVED: To provide a high-frequency power amplifier having higher performance by preventing characteristic deterioration or thermal runaways, due to heating of a high-frequency power amplifying element. SOLUTION: This high-frequency power amplifier, constituted of at least two semiconductor chips 3 and 7, is provided with a high frequency amplifying element 2 formed on one semiconductor chip 3 for amplifying an inputted high frequency power; and a bias circuit 4 whose at least one part is formed on the same semiconductor chip as that of the high-frequency power amplifying element for setting the operating point of the high-frequency power amplifying element, and is equipped with a reference voltage generating part 5 having the same temperature characteristics as those of the high-frequency power amplifying element.
申请公布号 JP2002084142(A) 申请公布日期 2002.03.22
申请号 JP20000272192 申请日期 2000.09.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MIYATSUJI KAZUO;KANAZAWA KUNIHIKO
分类号 H03F1/30;H03F3/213;H03F3/24;(IPC1-7):H03F1/30 主分类号 H03F1/30
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