发明名称 REMOVABLE MODULAR CELL FOR ELECTRO-CHEMICAL PLATING
摘要 <p>The present invention relates to a method and apparatus for depositing metal on a substrate. More particularly, one embodiment of the metal deposition cell comprising a cell base, an anode, and a cell top. The cell base at least partially defines an interior recess. The anode mounted within the interior recess to the cell base. The cell top is removably mounted to the cell base. In one embodiment, a method of removing a modular metal deposition cell from a deposition cell mount is provided. The modular metal deposition cell comprises a cell top and a cell bottom. The method comprises:unfastening a fastener that secures the cell top to the cell bottom, and also fastens the cell top and the cell bottom to the deposition cell mount. The cell top or the cell bottom are then removed from the deposition cell mount.</p>
申请公布号 WO2002022915(A2) 申请公布日期 2002.03.21
申请号 US2001028655 申请日期 2001.09.13
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