RESIN SEALING DEVICE AND RELEASING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a resin sealing device of a transfer molding system which enables simultaneous release of a molding and cull to be realized and injects resin into the lead frame area of a semiconductor device in order to upgrade the quality of moldings as well as a release method. SOLUTION: This resin sealing device has notched parts 1 which are connected to pots 13 and gates 14 formed in the bottom force 10 of a mold and inject the resin from the pots 13 as notches and ejector pins 2 which are fitted into the notched parts 1 and eject the resin injected and cured in the notched parts 1. The releasing method comprises the steps to integrally form a resin protuberance part 39 and the cull 38 and release the resin protuberance part 39 from the bottom force 10 simultaneously with the release of the moldings 37 and consequently release the cull 38 from the bottom force 10 simultaneously with the release of the molding 37.