发明名称 Method for manufacturing semiconductor device having a gate electrode film containing nitrogen
摘要 There is disclosed a semiconductor device which includes a semiconductor substrate having an element region and source and drain regions, a gate dielectric film containing nitrogen formed in the element region of said semiconductor substrate, a gate electrode formed on the gate dielectric film, a first dielectric film formed adjacent to the gate electrode so as to define a side wall therefor, a second dielectric film formed so as to cover the gate electrode and the first dielectric film, the second dielectric film being doped with nitrogen, and a third dielectric film formed so as to cover the second dielectric film, the third dielectric film being formed of silicon nitride. A method for manufacturing such a semiconductor device is also described.
申请公布号 US6358802(B1) 申请公布日期 2002.03.19
申请号 US19990298699 申请日期 1999.04.23
申请人 NEC CORPORATION 发明人 ODA NORIAKI
分类号 H01L29/78;H01L21/28;H01L21/318;H01L21/336;H01L21/768;H01L23/31;H01L29/49;H01L29/51;(IPC1-7):H01L21/336;H01L21/425;H01L21/265 主分类号 H01L29/78
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