| 摘要 |
PROBLEM TO BE SOLVED: To provide a dissolving solution for palladium or a palladium compound. SOLUTION: The solution includes one or more kinds of organic compounds each containing sulfur selected from a mercapto compound, a thioether compound, a disulfide compound or a cyclic thionic compound, or of their salts. The solution can be particularly used to eliminate palladium smut which is formed during the manufacture of a copper circuit board.
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