发明名称 PLATING METHOD OF PRINTED CIRCUIT BOARD SEMIAUTOMATIC PLATING LINE AND APPARATUS THEREFOR
摘要 PURPOSE: A plating method of a PCB(Printed Circuit Board) semiautomatic plating line and an apparatus therefor are provided to increase the productivity by transferring at a time two flybar to which a PCB is fixed. CONSTITUTION: Two flybars are inserted into a plating bath(1) to be plated. The plated flybars are transferred to an upward by a conveyer(3). Thereafter, the plated flybars are transferred to a washing bath(5). Two fixing units(6) are provided an upper of both sides of the washing bath(5). The washing bath(5) contains a wash liquid. The plated flybars are lifted up by the fixing units(6). A plurality of fixing grooves(7) are formed on the upper of each of the fixing units(6). The plated flybars are inserted into the fixing grooves(7).
申请公布号 KR100329102(B1) 申请公布日期 2002.03.06
申请号 KR19990024084 申请日期 1999.06.24
申请人 INNECTRON CO., LTD. 发明人 LEE, DONG HO
分类号 H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/00
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