| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor chip and its manufacturing method for mounting a semiconductor chip with high reliability. SOLUTION: A semiconductor chip 30 and a board 50 are different in coefficient of thermal expansion. Stress between the semiconductor chip 30 and the board 50 is caused by heat at the operation of the semiconductor chip 30, but is absorbed by a flexible second insulating layer 236 and an elastic copper plating post 239. Then, the cracking at an electric connection can be prevented, and high reliability of connection between the semiconductor chip 30 and the board is realized.</p> |
