| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor device excellent in moldability such as fluidity and curability, adhesion, and solder crack resistance, excellent in high-temperature preservation characteristics and in flame retardance without using a bromine compound or an antimony compound. SOLUTION: This epoxy resin composition for sealing the semiconductor device consists essentially of one or more kinds of phenol resins selected from phenol resins prepared by binding phenols to naphthols or naphthalenediols or the naphthols or naphthalenediols through methylene groups or xylylene groups, an epoxy resin obtained by glycidyl etherifying the phenol resins, an inorganic filler, a curing accelerator and a cyclic phosphazene compound.
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