| 摘要 |
PURPOSE: A solder pin structure of a monitor heat sink is provided to minimize mobility during soldering of legs of a solder pin by forming mobility preventing projections at the bottom of the legs. CONSTITUTION: A solder pin structure of a monitor heat sink comprises a reinforce element on a top of a circuit board and having a ninserting hole corresponding to an inserting hole of the circuit board, for supporting legs of the soldering pin(200), the legs of the soldering pin(200) having a bend(30) that is projected along its side. The thickness of the bend(30) corresponds to the width of the inserting hole of the circuit board. The legs of the soldering pin(200) is adhered closely into the inserting hole of the circuit board by the bend(30) and supported by a reinforce element on the top of the circuit board to prevent mobility of the solder pin(200).
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