发明名称 MOUNTING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To improve the manufacturing work efficiency of a mounting board. SOLUTION: The mounting board comprises copper films 21, 22, formed on both sides of a base 1 for boards, through-holes 3, 4 bored at prescribed positions of the base having the copper films, a prescribed pattern formed by etching the copper films, a first resist 6 applied to both sides of the base having the copper films, except for soldering regions 7 and the through-holes 3, 4, conductive members 8 provided in the prescribed through-holes 3 for conduction between the copper films on both sides of the base, conductive member resists 91, 92 applied in spot manner to the surfaces of the through-holes of the base with the conductive members existing therein, and soldering region resist 10 applied to the peripheries of the soldering regions 7 of the through-holes, allowing pins of elements to be soldered on the base to pierce. The conductive member resist 91 and the soldering region resin 10 are applied in the same step.
申请公布号 JP2002057425(A) 申请公布日期 2002.02.22
申请号 JP20000242169 申请日期 2000.08.10
申请人 SEIKO EPSON CORP 发明人 HIKUMA JUNICHIRO
分类号 H05K3/28;H05K1/02;H05K1/11;H05K3/40;(IPC1-7):H05K1/11 主分类号 H05K3/28
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