| 摘要 |
PROBLEM TO BE SOLVED: To provide a frame type member for resin injection, which enables an efficient work for coating the selected region on a circuit board with a resin. SOLUTION: This frame type member for resin injection is a frame type member for resin injection, which is used by superposing on a circuit board when the selected region on the circuit board mounted with an electronic component is coated with a resin, and the frame type member is characterized in that the frame type member is formed in such a way as to provide a resin injection aperture to correspond to the selected region in a plate material of a prescribed thickness, and in that the inner peripheral wall of the resin injection aperture is formed of a silicone.
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